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Brand Name : meihaowelder
Model Number : HN-3000
Place of Origin : suzhou china
MOQ : 1 set
Price : Negotiation
Payment Terms : T/T
Supply Ability : 1000 sets / month
Delivery Time : 5-8 work days
Packaging Details : Customized 7-ply heavy-duty cardboard box , 500*350*370mm
Application Example : Soldering FPC or FFC onto PCB
Increased Production Efficiency : Incorporating PID closed-loop control algorithm technology, the system enables rapid heating and cooling cycles, facilitating quick heat transfer and cooling
Superior Welding Quality : Utilizing the hot bar reflow soldering process ensures even heating and stable welding, resulting in consistent and high-quality soldering
Integration Capability : The controller is compatible with integration into other equipment, facilitating streamlined operations for large-scale production.
Hot Bar Soldering Controller for Soldering FPC or FFC onto PCB
The Hot Bar Soldering Controller is primarily utilized for hot bar reflow soldering of components such as FPCs, FFCs, and wire harnesses. It finds wide application in the production of consumer electronics, including mobile phones, cameras, headphones, USB devices, as well as automotive electronics and medical equipment. Common applications involve soldering FPCs, FFCs, wire harnesses, electronic sensors, and other components onto PCBs.
Hot bar reflow soldering, also known as pulse-heated reflow soldering, employs the Joule heat generated by pulse current passing through high-resistance materials like molybdenum and titanium for soldering purposes. During hot bar reflow soldering, pre-applied flux and tin-plated parts (such as FFCs and PCBs) are heated to a temperature sufficient to melt the solder. Upon cooling and solidification, these components form a permanent electrical and mechanical connection through the solidified solder.
The Hot Bar Soldering Controller utilizes pulse heating technology with PID closed-loop control algorithm for instant heating and cooling. This significantly enhances the efficiency of hot bar reflow soldering. The localized and instantaneous heating method employed in hot bar reflow soldering effectively controls the heat impact on surrounding components, without affecting the performance of neighboring components already installed around the soldering area.
The Hot Bar Soldering Controller features the capability to store 5 sets of programs, with each set containing 3 parameter groups. This enables easy switching between stored parameter sets for different hot bar reflow soldering tasks, eliminating the need for repetitive reconfiguration of soldering parameters. Moreover, each parameter group can be configured with 4 distinct heating profiles, accommodating the user's demand for multi-stage heating.
Specification Table for Hot Bar Soldering Controller
Product name | Hot Bar Soldering Controller |
Model | HN-3000 |
Rated voltage | AC 200V~240V 50Hz |
The output voltage | AC 3.8V |
Rated power | 3000W |
Thermocouple type | Type E, Type K |
Heating temperature set range | 50~600℃ |
Communication Interface | RS-485, Ethernet |
Number of program groups | 5 groups |
Number of parameter groups | 3 groups |
Number of temperature segments | 4 segments |
Parameter password | 7- inch true color touch screen |
Weight ( excluding wiring ) | 22 kg |
External dimensions ( mm ) | 245 x 314 x 229 |
Attention: Parameter changes caused by product upgrades or other factors will not be notified separately. The physical product shall prevail. Hereby declared! |
Examples of Hot Bar Soldering Controller Applications
Hot Bar Reflow Soldering for FPC-to-FPC Connections
Hot Bar Reflow Soldering for FPC-to-PCB Connections
Hot Bar Reflow Soldering for FFC-to-PCB Connections
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Hot Bar Soldering Controller for Soldering FPC or FFC onto PCB Images |